Siemens HMI Touch Panel

SIEMENS TOUCH PANEL / SIEMENS SIMATIC HMI, KTP1000, KTP170, TP177, TP277, OP277, MP177, MP277, MP377, MP370 SIMATIC TP277

Siemens pressure transmitter

SITRANS P DSIII ; SITRANS P250 ; SITRANS P300; SITRANS P Z ; SITRANS P ZD ; SITRANS P MPS ; 7MF4033 , 7MF4433 , 7MF4034 , 7MF4233

Yokogawa flow instrument AXF Series AXR Series flowmeter

Yokogawa flow instrument AXF Series AXR Series flowmeter , AXF002 , AXF010 , AXF025 , AXF032 , AXF050 , AXF080, AXF100 ,AXF125 ,AXF300

ABB PLC and Drive

ABB DCS400, DCS550, DCS800 DC Drives and ACS310 ,ACS355, ACS350, ACS510, ACS550 ,ACS800 AC Drives . ABB DCS / PLC system parts: AC500: PM571, PM581, PM571-ETH, PM582-ETH, AI523, TU531, TK501, CI581-CN AC700F: PM783F , AI723F , TA724, TU715F, TB711F, CP-C MM AC800M: PM851K01, PM861AK01, SB821, PM865AK01, CI854AK01, TB850 AC800F: PM802F, PM803F, SA801F, EI803F, EI813F, FI810F, FI830F ,TK807F, SB808F S800 I/O: AI801, DI801, DI802, DO801, AI810, AI810, DI820, DO810, TU810V1, TB807

New IC manufacturing lines to boost total industry wafer capacity 8%

IC industry wafer capacity, specifically in the memory segment, was inadequate to meet demand throughout 2017. However, with Samsung, SK Hynix, Micron, Intel, Toshiba/WD, and XMC/Yangtze River Storage Technology planning to significantly ramp up 3D NAND flash capacity over the next few years, and Samsung and SK Hynix boosting DRAM capacity this year and next, what does this mean for total industry capacity growth? In its 2018-2022 Global Wafer Capacity report, IC Insights shows that new manufacturing lines are expected to boost industry capacity 8% in both 2018 and 2019 (Figure 1). From 2017-2022, annual growth in IC industry capacity is forecast to average 6.0% compared to 4.8% average growth from 2012-2017.

Development of spray forming technology

China’s spray forming technology research and product development is relatively backward than industrial countries, but after nearly twenty years of research and development, has made great progress, especially in recent years introduced a number of advanced spray forming equipments and technologies from abroad, it should be said that there has been a good foundation and conditions for product development and industrialization, but it is rarely used in products.From the analysis of research and application in various countries, the spray forming technology can be applied in the following aspects

High performance of rapid solidified Si-Al alloys

novel Si-Al alloy was prepared by rapid solidification technology for electronic packaging. After year's of experience and development,the studies outcomes indicate that the alloys (Si-(27%–70%)Al) have advantageous physical and mechanical characteristics, including low coefficient of thermal expansion (7.5 ppm/℃–17 ppm/℃), high thermal conductivity (120–175 W/(m.K)), low density (2.43–2.64 g/cm3), high ultimate flexural strength (180–220 MPa) and Brinell hardness (162–261)

Aluminium- Aplication and Physical Properties

Pure aluminium is soft, ductile, corrosion resistant and has a high electrical conductivity. It is widely used for foil and conductor cables, but alloying with other elements is necessary to provide the higher strengths needed for other applications. Aluminium is one of the lightest engineering metals, having a strength to weight ratio superior to steel.

What are the uses of aluminum alloys in aircraft manufacturing?

Aluminum alloy has the characteristics of light weight, high strength, corrosion resistance and easy processing. It has a wide range of uses in various industries, such as decoration and decoration, electronic appliances, mobile phone accessories, computer accessories, mechanical equipment, aerospace, transportation, military, etc. field. Below we focus on the application of the lower aluminum alloy in the aerospace field.